Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model.
Meng-Kao YehChun-Lin LuPublished in: Microelectron. Reliab. (2016)
Keyphrases
- reliability analysis
- finite element model
- finite element
- experimental data
- finite element analysis
- boundary conditions
- mechanical properties
- finite element methods
- numerical simulations
- measured data
- material properties
- condition monitoring
- deformable object tracking
- stress response
- theoretical analysis
- simulated annealing
- machine learning
- nonlinear finite element
- neural network