Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits.
Libo QianZhangming ZhuYintang YangPublished in: Microelectron. J. (2012)
Keyphrases
- integrated circuit
- three dimensional
- electron beam
- metal oxide semiconductor
- optimization method
- high speed
- semiconductor devices
- image sequences
- discrete optimization
- optimization process
- global optimization
- optimization problems
- d objects
- human body
- optimization algorithm
- high density
- printed circuit boards
- x ray
- low cost
- data sets
- virtual reality
- combinatorial optimization
- image analysis
- computing systems