Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations.
Ronald SchöngrundnerMegan Jo CordillG. A. MaierHans-Peter GänserPublished in: Microelectron. Reliab. (2015)
Keyphrases
- finite element
- printed circuit boards
- finite element analysis
- finite element method
- soft tissue
- finite difference
- tv camera
- boundary element
- finite element model
- numerical solution
- material properties
- numerical simulations
- mesh generation
- gpu accelerated
- visual inspection
- degrees of freedom
- pattern recognition
- manufacturing process
- integrated circuit
- knowledge engineering
- biomechanical model
- level set
- object oriented