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CMOS scaling and three-dimensional silicon integration.

Philippe JansenLarry Starr
Published in: CICC (2005)
Keyphrases
  • three dimensional
  • high speed
  • low cost
  • cmos technology
  • computer vision
  • d objects
  • data integration
  • x ray
  • high density
  • analog vlsi
  • virtual reality
  • range images
  • power consumption
  • surface reconstruction