Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages.

Yu Gu Toshio Nakamura

Published in: Microelectron. Reliab. (2004)

Keyphrases

high speed
low cost
printed circuit boards
estimation accuracy
analog vlsi
density estimation
failure rate
high temperature
vlsi design
high bandwidth
single chip
circuit design
software packages
data sets
accurate estimation
robust estimation
parameter estimation
least squares