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Three-Dimensional Chips Can Be Cool: Thermal Study of VeSFET-Based 3-D Chips.
Xiang Qiu
Malgorzata Marek-Sadowska
Wojciech P. Maly
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2015)
Keyphrases
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three dimensional
high speed
integrated circuit
high density
real time
artificial intelligence
computer vision
decision trees
computer systems
x ray
empirical studies
infrared
depth map
theoretical framework
simulation study
high end