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Fabrication and packaging of microbump interconnections for 3D TSV.
Seung Wook Yoon
Jae Hoon Ku
Nathapong Suthiwongsunthorn
Pandi Chelvam Marimuthu
Flynn Carson
Published in:
3DIC (2009)
Keyphrases
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high density
data center
magnetic recording
thin film
information systems
data structure
hidden markov models
neural network
real world
machine learning
artificial neural networks
low cost
field effect transistors
plasma etching