Login / Signup
A 100 Gb/s DC-Coupled Optical Modulator Driver for 3D Photonic Electronic Wafer-Scale Packaging.
Xiao Liu
Xi Zhang
Domine Leenaerts
Marion K. Matters-Kammerer
Published in:
ISCAS (2020)
Keyphrases
</>
high speed
physical characteristics
integrated circuit
scale space
real time
high density
semiconductor manufacturing