Login / Signup

Reliability aspects of copper metallization and interconnect technology for power devices.

Frank HilleRoman RothCarsten SchäfferHolger SchulzeNicolas HeuckDaniel BolowskiKarsten GuthAlexander CilioxKarina RottFrank UmbachMartin Kerber
Published in: Microelectron. Reliab. (2016)
Keyphrases