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Modeling and evaluation for electrical characteristics of through-strata-vias (TSVS) in three-dimensional integration.
Zheng Xu
Adam Beece
Kenneth Rose
Tong Zhang
Jian-Qiang Lu
Published in:
3DIC (2009)
Keyphrases
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relational databases
three dimensional
databases
physical characteristics
model driven
information retrieval
object recognition
image sequences
d objects
multi view
data integration
data fusion
evaluation method
evaluation metrics
integrated circuit
high density
evaluation model
object modeling
genetic algorithm