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Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC.
Shudong Lin
Gordon W. Roberts
Published in:
ETS (2014)
Keyphrases
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general purpose
mixed signal
vlsi circuits
low power
multi channel
special purpose
application specific
multi layer
programming language
digital circuits
cmos technology
pattern recognition
low cost
machine vision
high speed