Login / Signup

Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures.

Ujjwal PasupuletyBheemappa HalavarBasavaraj Talawar
Published in: ISED (2018)
Keyphrases
  • network on chip
  • packet switched
  • cmos technology
  • routing algorithm
  • real time
  • power dissipation
  • design process
  • multi processor
  • wireless sensor networks
  • high speed
  • design methodology
  • network simulator