Login / Signup
Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors.
Ji Heon Lee
Young Seo Lee
Jeong Hwan Choi
Hussam Amrouch
Joonho Kong
Young-Ho Gong
Sung Woo Chung
Published in:
IEEE Access (2021)
Keyphrases
</>
personal computer
infrared
computing power
image processing
web services
practical application
genetic algorithm
information systems
case study
artificial neural networks
general purpose
single chip
thermal images
thermal infrared
thermal conductivity
solder ball connect