Chip to carrier C4 technology challenges with Pb free solders.

Eric D. Perfecto Brian Sundlof Kamalesh Srivastava Minhua Lu

Published in: CICC (2008)

Keyphrases

mechanical properties
technological advances
cost effective
key technologies
low cost
data processing
future trends
real world
paradigm shift
high density
enabling technologies
cmos technology
technical issues
lessons learned
high speed
open issues
low power
optimization methods
metal oxide semiconductor