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Solderless bonding with nanoporous copper as interlayer for high-temperature applications.

Siyu SunQiang GuoHongtao ChenMingyu LiChunqing Wang
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • high temperature
  • inter layer
  • single layer
  • base layer
  • inter frame
  • scalable video coding
  • rate distortion
  • computer vision
  • neural network
  • feed forward