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Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics.

F. L. LauRiko I. MadeW. N. PutraJ. Z. LimV. C. NachiappanJ. L. AwChee Lip Gan
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • high temperature
  • printed circuit boards
  • data sets
  • diesel engine
  • real time
  • genetic algorithm
  • mechanical properties