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Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.

Miku J. LaaksoSimon J. BleikerJessica LiljeholmGustaf E. MartenssonMikhail AsiaticiAndreas C. FischerGoran StemmeThorbjorn EbeforsFrank Niklaus
Published in: IEEE Access (2018)
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