Investigations of silicon wafer grinding using finite element analysis.
J. H. LiuZ. J. PeiG. R. FisherPublished in: Int. J. Comput. Appl. Technol. (2007)
Keyphrases
- finite element analysis
- finite element
- computer aided design
- finite element model
- semiconductor manufacturing
- material properties
- integrated circuit
- high speed
- high density
- using artificial neural networks
- friction coefficient
- temperature field
- stress distribution
- databases
- contact force
- manufacturing process
- experimental data
- liquid crystal
- database systems
- neural network