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Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation.
Daniel W. M. Veldman
Rob H. B. Fey
Hans Zwart
Marc M. J. van de Wal
Joris D. B. J. van den Boom
Henk Nijmeijer
Published in:
IEEE Trans. Control. Syst. Technol. (2021)
Keyphrases
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thermal conductivity
dynamic programming
optimal solution
degrees of freedom
heat transfer
infrared
optimal strategy
semiconductor manufacturing
multiresolution
image registration
optimal design
deformation field
solder ball connect