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Optimal Thermal Actuation for Mitigation of Heat-Induced Wafer Deformation.

Daniel W. M. VeldmanRob H. B. FeyHans ZwartMarc M. J. van de WalJoris D. B. J. van den BoomHenk Nijmeijer
Published in: IEEE Trans. Control. Syst. Technol. (2021)
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