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3D-HIM: A 3D High-density Interleaved Memory for bipolar RRAM design.
Yi-Chung Chen
Hai Li
Wei Zhang
Robinson E. Pino
Published in:
NANOARCH (2011)
Keyphrases
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high density
low density
close proximity
magnetic recording
high power
design process
case study
thin film
data mining
user interface
design principles
memory usage
computing power