Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked DRAM -.
Jung-Won HanS. H. ParkM. Y. JeongK. S. LeeK. N. KimH. J. KimJ. C. ShinS. M. ParkS. H. ShinS. W. ParkK. S. LeeJ. H. LeeS. H. KimB. C. KimM. H. JungI. Y. YoonH. KimS. U. JangK. J. ParkY. K. KimI. G. KimJ. H. OhS. Y. HanB. S. KimB. J. KuhJ. M. ParkPublished in: VLSI Technology and Circuits (2023)