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Simulation Methodology and Evaluation of Through Silicon Via (TSV)-FinFET Noise Coupling in 3-D Integrated Circuits.
Brad D. Gaynor
Soha Hassoun
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2015)
Keyphrases
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integrated circuit
discrete event simulation
evaluation model
simulation model
evaluation methodology
noisy data
design methodology
noise model
low cost
mathematical models
electron beam
information retrieval
evaluation method
noise free
metal oxide semiconductor