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Circuit Level Reliability Analysis of Cu Interconnects.

Syed M. AlamChee Lip GanCarl V. ThompsonDonald E. Troxel
Published in: ISQED (2004)
Keyphrases
  • reliability analysis
  • input output
  • high speed
  • real world
  • machine learning
  • artificial intelligence
  • feature selection
  • artificial neural networks
  • power dissipation