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High density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon chip.
Yutaka Urino
Tsuyoshi Horikawa
Takahiro Nakamura
Yasuhiko Arakawa
Published in:
OFC/NFOEC (2013)
Keyphrases
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high density
fiber optic
high bandwidth
low density
close proximity
high power
thin film
liquid crystal
optical properties
data center
magnetic recording
chemical vapor deposition
high speed
input output
high order
power distribution