Yield prediction in semiconductor manufacturing using an AI-based cascading classification system.
Peter StichMichael G. WahlPeter CzernerChristian WeberMadjid FathiPublished in: EIT (2020)
Keyphrases
- semiconductor manufacturing
- classification accuracy
- artificial intelligence
- prediction algorithm
- feature selection
- support vector machine
- pattern classification
- classification algorithm
- support vector machine svm
- supervised learning
- expert systems
- discrete event simulation
- machine learning
- prediction accuracy
- feature vectors
- decision trees
- feature extraction
- support vector
- preprocessing
- decision rules
- pattern recognition
- training data
- machine learning algorithms
- image classification
- feature set
- classification method
- classification models
- prediction error
- automatic classification
- classification rate
- process control
- least squares support vector machine
- nearest neighbour algorithm
- body mass index
- predictive modeling
- regression model
- bit rate
- knn
- face recognition
- learning algorithm