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On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits.
Qinghua Hu
Wen-Sheng Zhao
Kai Fu
Da-Wei Wang
Gaofeng Wang
Published in:
IET Circuits Devices Syst. (2021)
Keyphrases
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integrated circuit
power distribution networks
distribution network
metal oxide semiconductor
carbon nanotubes
smart grid
low cost
electron beam
high density
neural network
evolutionary algorithm
supply chain
mathematical model
information technology