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TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations.
Dengfeng Wang
Liukai Xu
Songyuan Liu
Zhi Li
Yiming Chen
Weifeng He
Xueqing Li
Yanan Sun
Published in:
ICCAD (2023)
Keyphrases
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high density
high power
low density
close proximity
thin film
magnetic recording
high bandwidth
power consumption
real time
magnetic tape
data center
low power
end to end
power supply
wireless networks
high speed
fuzzy logic