Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts.
Ming-Jer JengKuo-Ling ChiangHsin-Yi ChangChia-Yi YenCheng-Chen LinYuan-Hsiao ChangMu-Jen LaiYu-Lin LeeLiann-Be ChangPublished in: Microelectron. Reliab. (2012)
Keyphrases
- high speed
- light emitting diodes
- cmos technology
- silicon on insulator
- low power
- video camera
- light emitting
- high density
- low cost
- frame rate
- image sensor
- metal oxide semiconductor
- parallel processing
- mixed signal
- power consumption
- data transmission
- real time
- power dissipation
- heat transfer
- digital camera
- ibm power processor
- ultra low power
- cmos image sensor
- single chip
- energy efficiency
- spatio temporal
- image processing