On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification.

Po-Yuan Chen Cheng-Wen Wu Ding-Ming Kwai

Published in: Asian Test Symposium (2009)

Keyphrases

high speed
low cost
integrated circuit
high density
software testing
vlsi implementation
database
image processing
case study
test set
test cases
low power
cmos technology
vlsi design
host computer