Low-cost vertical coupling schemes for optical I/Os and 3D integration in CMOS photonic integrated circuits.
Dimitris TsiokosGeorge DabosJens BoltenNikos PlerosPublished in: ICTON (2017)
Keyphrases
- integrated circuit
- low cost
- metal oxide semiconductor
- electron beam
- printed circuit boards
- low power
- physical characteristics
- high speed
- single chip
- image sensor
- digital camera
- hardware and software
- real time
- range queries
- data integration
- embedded systems
- external memory
- delay insensitive
- cost model
- memory space
- computing systems
- highly efficient
- efficient implementation
- motion estimation
- image processing