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Development of high-temperature solders: Review.

Guang ZengStuart D. McDonaldKazuhiro Nogita
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • high temperature
  • mechanical properties
  • case study
  • software engineering
  • literature review
  • current status
  • systematic review
  • theoretical analysis
  • information processing