Modeling of a plasma processing machine for semiconductor wafer etching using energy-functions-based neural networks.
Fathi M. A. SalamChristian PiwekGamze ErtenTimothy A. GrotjohnJes AsmussenPublished in: IEEE Trans. Control. Syst. Technol. (1997)
Keyphrases
- plasma etching
- energy function
- neural network
- graph cuts
- thin film
- energy minimization
- semiconductor manufacturing
- integrated circuit
- high density
- low density
- batch processing
- markov random field
- wafer fabrication
- image segmentation
- problems in computer vision
- belief propagation
- shape model
- multi layer
- global minimum
- active contours
- graphical models
- similarity measure
- genetic algorithm
- regularization framework