On-Die Interconnect and Other Challenges for Chip-Level Multi-Processing.
Tryggve FossumPublished in: Hot Interconnects (2007)
Keyphrases
- high speed
- real time
- levels of abstraction
- lessons learned
- data processing
- higher level
- key issues
- power dissipation
- scalability issues
- open issues
- image sensor
- real world
- database
- high density
- information processing
- low cost
- processing capabilities
- genetic algorithm
- neural network
- vlsi implementation
- evolvable hardware
- vlsi design