A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process.
Lanyu ZhangJian GaoYunbo HeXin ChenYun ChenHui TangZhijun YangPublished in: IEEE Trans. Ind. Electron. (2021)
Keyphrases
- optimization process
- significant improvement
- cost function
- experimental evaluation
- computational cost
- similarity measure
- neural network
- support vector machine
- recognition process
- high precision
- synthetic data
- support vector machine svm
- high speed
- high accuracy
- dynamic programming
- multiresolution
- artificial neural networks
- preprocessing
- markov random field
- optimization algorithm
- clustering method
- design process
- detection method
- mathematical model
- matching algorithm
- optimization method
- support vector
- parameter tuning
- multiscale