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Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes.

Hassen MedjahedPaul-Etienne VidalBertrand Nogarede
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • high power
  • high density
  • power supply
  • low power
  • real time
  • multiscale
  • edge detection
  • maximum likelihood
  • stress response