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Dependence of copper interconnect electromigration phenomenon on barrier metal materials.
Masashi Hayashi
Shinji Nakano
Tetsuaki Wada
Published in:
Microelectron. Reliab. (2003)
Keyphrases
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stainless steel
high speed
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grain size
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materials science
genetic algorithm
knowledge base
bayesian networks
evolutionary algorithm
dependence structure
chemical vapor deposition