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Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package).
Cho-Liang Chung
Liang-Tien Lu
Yao-Jung Lee
Published in:
Microelectron. Reliab. (2005)
Keyphrases
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constraint satisfaction problems
low cost
database
real time
search algorithm
evolutionary algorithm
high speed
infrared
high density
reliability analysis