Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging.

Takuya Wadatsumi Kohei Kawai Rikuu Hasegawa Kikuo Muramatsu Hiromu Hasegawa Takuya Sawada Takahito Fukushima Hisashi Kondo Takuji Miki Makoto Nagata

Published in: IEICE Trans. Electron. (2023)

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