Automated solder joint inspection system using optical 3-D image detection.
Yukio MatsuyamaToshifumi HondaHisae YamamuraHideaki SasazawaMineo NomotoTakanori NinomiyaAnton SchickLudwig ListlPaul KöllenspergerDieter SpriegelPeter MengelRichard SchneiderPublished in: WACV (1996)
Keyphrases
- image data
- image classification
- input image
- single image
- image capture
- low level
- segmentation method
- aerial images
- image analysis
- image features
- image content
- multiscale
- template matching
- image matching
- hough transform
- detection algorithm
- image collections
- pixel values
- image pixels
- image retrieval
- similarity measure
- detection method
- spatial information
- image representation
- region of interest
- road signs
- complex background
- surface defects
- white light
- motion parallax
- printed circuit boards
- bounding box
- object detection
- edge detection
- image regions
- keypoints