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Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test.

Qiang GuoSiyu SunZhihao ZhangHongtao ChenMingyu Li
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • mechanical properties
  • electron microscopy
  • real time
  • databases
  • test data
  • artificial intelligence
  • evaluation criteria
  • software evolution