Through Silicon Capacitive Coupling (TSCC) interface for 3D stacked dies.

Katsuyuki Ikeuchi Makoto Takamiya Takayasu Sakurai

Published in: 3DIC (2011)

Keyphrases

user interface
low cost
direct manipulation
user friendly
natural language interface
visual interface
human computer interface
gallium arsenide
information retrieval
learning algorithm
artificial intelligence
database systems
multiscale
high speed
high density
graphical interface