In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs.
Takeshi MatsumotoTeruo KurahashiRyotaro KonoikeKen TanizawaKeijiro SuzukiAyahito UetakeKazumasa TakabayashiKazuhiro IkedaHitoshi KawashimaSuguru AkiyamaShigeaki SekiguchiPublished in: OFC (2018)
Keyphrases
- high speed
- high density
- low cost
- liquid crystal
- closely spaced
- real time
- cmos technology
- printed circuit boards
- circuit design
- focal plane
- charge coupled device
- electro optic
- service oriented
- physical design
- single chip
- reconfigurable hardware
- low power
- solid state
- vlsi implementation
- integrated circuit
- analog vlsi
- metal oxide semiconductor
- line segments