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Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling.
J. B. Libot
Joël Alexis
Olivier Dalverny
L. Arnaud
P. Milesi
F. Dulondel
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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thermal conductivity
electron microscopy
composite materials
mechanical properties
x ray
infrared
thin film
simplex method
room temperature
heat transfer
white matter
linear programming
surface temperature
database
computer vision
thermal images
learning algorithm
real time