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Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps.

Cheng-Chen LinLiann-Be ChangMing-Jer JengChia-Yi YenAtanu DasChung-Yi TangMing-Yi TsaiMu-Jen Lai
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • low cost
  • high density
  • viewpoint
  • high speed
  • statistical analysis
  • electrical properties
  • light emitting diodes