A built-in method for measuring the delay of TSVs in 3D ICs.
Han-Yu WuYong-Xiao ChenJin-Fu LiPublished in: ETS (2016)
Keyphrases
- high accuracy
- synthetic data
- main contribution
- experimental evaluation
- mathematical model
- significant improvement
- detection method
- segmentation algorithm
- theoretical analysis
- em algorithm
- data sets
- classification accuracy
- cost function
- prior knowledge
- experimental study
- fully automatic
- objective function
- clustering method
- high precision
- detection algorithm
- evaluation method
- optimization algorithm
- edge detection
- support vector machine svm
- sufficient conditions
- semi supervised
- computational cost
- multiresolution
- artificial neural networks
- preprocessing
- computational complexity
- video sequences
- similarity measure