Login / Signup

Beyond 10 μm Depth Ultra-High Speed Etch Process with 84% Lower Carbon Footprint for Memory Channel Hole of 3D NAND Flash over 400 Layers.

Yoshihide KiharaMaju TomuraWataru SakamotoMasanobu HondaMasayuki Kojima
Published in: VLSI Technology and Circuits (2023)
Keyphrases
  • high speed
  • memory usage
  • data sets
  • manufacturing process
  • database
  • data structure
  • process control
  • memory space