A new die-level flexible design-for-test architecture for 3D stacked ICs.

Qingping Zhang Wenfa Zhan Xiaoqing Wen

Published in: Integr. (2024)

Keyphrases

software architecture
architectural design
design process
design tools
lightweight
design principles
neural network
experimental design
design methodology
user interface
computer aided
test data
management system
levels of abstraction
knowledge level
hardware design
real time
modular architecture