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Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP.

Y. A. SuLong Bin TanT. Y. TeeVincent B. C. Tan
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • electron microscopy
  • key properties
  • decision trees
  • multiscale
  • database
  • real time
  • neural network
  • data mining
  • computer vision
  • wide range
  • desirable properties