T. Y. Tee

Publication Activity (10 Years)

Years Active: 2009-2010
Publications (10 Years): 0

Publications

Y. A. Su, Long Bin Tan, T. Y. Tee, Vincent B. C. Tan
Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP. Microelectron. Reliab. 50 (4) (2010)
Z. W. Zhong, T. Y. Tee
Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs. Proc. IEEE 97 (1) (2009)