Low-cost testing of TSVs in 3D stacks with pre-bond testable dies.

Sying-Jyan Wang Yu-Siao Chen Katherine Shu-Min Li

Published in: VLSI-DAT (2013)

Keyphrases

low cost
low power
real time
cost effective
single chip
hardware and software
databases
information retrieval
computer vision
case study
bayesian networks
relational databases
test cases
highly efficient